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POSTER: computer news || INTEL PENRYN
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DATE:2007-01-29
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On strategy, which Intel calls Tick-Tock model, and which consists in the fact that the architecture checked is transferred into the new technical process, after which the processors of new architecture are released according to the already checked technological standards, we already said. The following technical process, 45 nm, will be mastered by company on the processors of generations penryn - Yorkfield and Wolfdate (Wolfdale), which too architecturally are not differed from present Core 2 Duo/extreme. change in architecture will occur in the generation processors nehalem.
However, about some technological update, which will be inculcated in Penryn, politely described the leaders Of intel, Mark Bohr Steve Smith.
Thus, dual core processors penryn (code name wolfdate) will consist on 410 mln. transistors, four core processor Wolfdate - 820 mln. for comparison - into Conroe (Core 2 Duo) - 298 mln. transistors.
The retention of processor socket 775 for such processors will not become the guarantee of compatability with present motherboard with them - there is probability of electrical incompatibility.
Representatives Intel confirmed that Penryn will differ from Conroe in terms of the new materials, utilized as the dielectric - will be produced failure from silicon dioxide, which is used Intel last of decade, in the benefit of dielectrics with the high dielectric constant (high- k). This will make possible to forego the locks from polycrystalline silicon and to use metallic. Only this one step is capable by 20% to increase the switching rate of transistors and to, as a result, increase processor speed .
Gordon Moore, the author of famous law, calls the introduction high- k dielectrics very significant change in the technology production transistors from the end 60- X years. Then were represented transistors with the ploly lock.
The material, utilized as high- k dielectric, contains hafnium, there is no other information about it.
The production of processors penryn starts in the second-half of the present year at the factories D 1d in Oregon, Fab 32 in Arizona and, only later, to Fab 28 in Israel.
Also something it was described by the officials intel, also, about the more distant plans of company. The production schedule in the improvement of lithographic processes intel does not from now on conclude with 32- nm by standards. The technical process, which has the code name p1270 will they will take root by company beginning from 2011 and will be indicate the beginning of introduction 22- nm n.
Completed their appearance representatives Intel by the following thesis: The architecture nehalem will appear in 2008. Intel penryn |
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INTEL PENRYN |
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POSTER: news || STMICROELECTRONICS ALLIANCE CROLLES2
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DATE:2007-01-28
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Yesterday we already concerned the theme of the participation sTMicroelectronics in th alliance crolles2 decomposed on the eyes; therefore we could not pass past the intentions of company, expressed to the press conference for analysts and investors. ST is intended to create the technology of production 32- nm microcircuits, together, as said the executive director of company of Porta Carlo bozotti, with some leaders of industry. however, it is completely probable that the discussion deals not only with TSMC (and, in general, entirely even not about it, as this it will be understandably below), they entend to remain into Crolles2 even after withdrawal from the alliance freescale and NXP. Let us recall that last two companies will leave alliance after the completion of works on the 45- nm technologies production, planned in 2007.
Taking into account the increased cost R & D (scientific research and experimental design works) for the 32- nm technologies, ST is intended to get license [KMOP]- process and to use laboratories crolles for developing the technologies of production specialized microcircuits and units. In particular, such as the sensors of images, high-frequency and analog units.
Thus, it is obvious - ST returns report in the fact that the situation in the semiconductor industry changed and the presence of its own technology production KMOP- microcircuits is no longer the competitive advantage. And, in a certain measure, intentions ST are similar to the intentions TI, which completely plans to forego the development of 32- nm technologies production of digital microcircuits. sTMicroelectronics alliance crolles2 |
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POSTER: AMD news || AMD ATHLON 64 X2 6000+
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DATE:2007-01-28
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Approximately simultaneously appeared information about the beginning of sales for the elder models processors AMD athlon 64 X2. The discussion deals with processors athlon 64 X2 5600+ and Athlon 64 X2 6000+.
Athlon 64 X2 6000+ in on-line- store newEgg (USA)
Appearance Of athlon 64 X2 5600+ in retail Japan
The model 5600+ Socket AM2, which appeared in sale, has the frequency of 2,8 GHz, 1mb. x 2 caches in the second level and it is produced on 90nm technical process with the application OF SOI. In the Japanese stores the cost of this new product was 555 dollars.
To the model 6000+ Socket AM2, whose price is already declared - 720 dollars ; in Japan only began to assume orders. This processor has the frequency 3 GHz, the remaining parameters are the same as in 5600+.
At this time in the on-line- store newEgg (USA) athlon 64 X2 6000+ has already been sold on the price of 599 dollars ; which even is lower than 607 dollars ; appointed as producer (!). Buy.com, in contrast to NewEgg, proposes new CPU on the price of 686 dollars ; which seems more adequate and it is located nearer to Japanese retail, being lower. Even with this price in Buy.com no longer it remained processors into the presence…
As we see, sales in USA already started (by small parties), although this processor (ADX6000IAA6CZ) had to be declared only in three weeks (what apparently and they wait until the Japanese). AMD athlon 64 X2 6000+ |
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AMD ATHLON 64 X2 6000+ |
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POSTER: memory news || HYNIX MEMORY DDR2 800 MHZ
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DATE:2007-01-26
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EE times reports that Hynix semiconductor have the ready two-gigabyte memory modules DDR2, which function at frequency 800 MHz. Producer those new module the fastest on the market at the current moment.
In the production of hynix modules was used the technology WLP (wafer-level packaging), which consist in the fact that 300- mm of the base layer is covered with plastic, it will be tested and then only it is cut, but it is not packed into the case in the stage subsequent after cutting.
This approach according to of producer, makes possible to decrease the production costs for 20%, and in addition to this, to increase stability, to decrease heat emission, etc.
In the production of new DDR2 are used by 90 nm technological standards, however, in the near future hynix plans to inject technology WLP, also, in the production gigabyte chips on 60- nm technical process, about which it was declared not so long time ago.
On that, when to expect the beginning of mass sales for new modules Korean company, it does not thus far report. Hynix memory ddr2 800 MHz |
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HYNIX MEMORY DDR2 800 MHZ |
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