- amd dtx specifications - nvidia CUDA GPU calculation - intel hafnium as oxide silicon - phase memory hitachi -

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POSTER: computer news   ||   AMD DTX SPECIFICATIONS	DATE:2007-02-20
Company AMD promulgated management on the proposed by it design DTX of systems small form factor (small form factor (SFF)). In the opinion of company specialists these specifications will make possible to create compact and low-noise desktop systems. Standard DTX is based on specifications ATX and describes requirements for motherboard. At the given moment the management of ten pages includes the minimum set of parameters on the interchangeability. AMD gives the possibility for OEM/ODM  producers a little to step back from management, which gives to them a certain freedom of actions, which will, possibly, become the efficient lever of increase in the effectiveness of the developed products. Basic requirements for DTX and mini-DTX consist in the fact that on sizes and quantity of components motherboard are superimposed the specific limitations. Thus, according to the specification proposed, the sizes of mini-DTX must not exceed 170,18 x 203,20 mm, that even somewhat less than micro-ATX (244 X 244 mm), but a little more than the standard mac mini (163 X 163 mm). The amount of motherboard DTX will be limited by parameters 243,84 x 203,20 mm (ATX is completely giant with its 305 X 244 mm). Other requirements, presented in the management AMD, describe attaching holes in the system motherboard, sizes and arrangement of rear panel in/out, and also the arrangement of  PCI and PCI express. amd dtx specifications	Add Comment ( 0 ) AMD DTX SPECIFICATIONS

POSTER: computer news   ||   NVIDIA CUDA GPU CALCULATION	DATE:2007-02-20
At the end of past weeks NVIDIA declared about the beginning of public beta- testing of CUDA, pack for developers, earlier than the accessible to the small circle to the company. This means that in the near future it is worthwhile to expect the appearance of different IN, the achieving calculation not on CPU and on GPU. Graphic processor video card geForce 8800 GTX can reach peak performance in 520 gigaflop (GFLOPS, billion of operations with floating point in second) thus SLI- system can cross mark in teraflop. Because of technology CUDA parallel computational possibilities GPU are now accessible to practically all developers through the standard language programming C. the developers they can download the beta- version CUDA SDK and C compilator for Windows XP and Linux (RedHat release 4 Update 3) from NVIDIA site . In the user medium with the aid of CUDA will be able to be calculated physics in games. Among the more serious tasks - the calculations in seismology, finances, hydrodynamics, medicine and the like also graphic card can simulate the work of neurons brain, the behavior of electromagnetic waves… It is necessary to note that in the comparison with traditional narrowly specialized coprocessors, intended for fulfilling operations with floating point (Clearspeed CSX600 and similar), the accelerators NVIDIA have essential deficiencies. They are capable of working only in 32- bit, but not 64- bit regime, giving the result of calculations with the single accuracy, instead of  required dual. Company says that this deficiency will be removed in accelerators, which will leave more lately in the present year. By the way, the same limitation is characteristic of the processor tera-Scale, developed by intel. nvidia CUDA GPU calculation	Add Comment ( 0 ) NVIDIA CUDA GPU CALCULATION

POSTER: computer news   ||   INTEL HAFNIUM AS OXIDE SILICON	DATE:2007-02-20
Hafnium rarely became the hero of news, in the beginning of month scientific research consortium semiconductor research corporation  declares about revolutionary success in the creation of insulators, which contain this metal. On available data, company intel and IBM they plan to use hafnium for creating the more rapid and energetically more effective microprocessors. The oxide of hafnium will replace the oxide silicon utilized now. Thus, the element, which occupies in the chemical table in 72 position, must ensure breakthrough in the future generation of semiconductor devices. Producers expect to use it in the chips, which are encountered very widely – from the cell phones to servers. But how to use rare product for mass production? Specialists consider that there is no occasion for the uneasiness. Mainly because the quantity of hafnium, utilized in one chip, is negligibly small. (Jim mcGregor), the analyst of organization In -Stat,  says: Even if we take entire hafnium, necessary for 300- mm plate, it it is not possible to see with the naked eye. (Bernard meyerson), the chief technologist OF IBM, expressed situation even more descriptive: according to him, if we take one cubic centimeter of hafnium and to distribute over by the surface layer of this thickness, which is used in chips, will be covered the area, equal to 10 football fields. Moreover, this estimation is undertaken with the reserve to the worse side first, it is used not pure hafnium, but its oxide, in the second place, thickness of the layer in proportion to the perfection of technology will be constantly reduced. Thus, the expenditure of hafnium is low. But as does proceed the matter from its outputs? Yearly all countries, together, obtain about 50 tons of this substance. It is not encountered in the form it lived as gold or other metals, but it is obtained as product during the output of the dioxide of zirconium (zirconium - metal, sufficiently widespread in the territory USA, Brazil, Australia, Russia and China). The proximity of atomic structures hafnium and zirconium makes the process of separation that being expensive. About 60-70% of obtained hafnium go to the production of the so-called graphite rods, utilized for control of reaction in  nuclear reactor. The large part of remaining hafnium proceeds with the production of alloys, used in the aircraft engines. A question about a deficiency in hafnium thus far did not arise, and its output if necessary can be increased. By others words, to fear, it seems, something. Taking into account that semiconductor branch expects to consume small volumes of material, and the volumes of its output can be increased, branch experts do not see reasons for the appearance of competition between the users of hafnium, at least, over the short term long term. intel hafnium as oxide silicon	Add Comment ( 0 ) INTEL HAFNIUM AS OXIDE SILICON

POSTER: computer news   ||   PHASE MEMORY HITACHI	DATE:2007-02-20
The new generation of energy-independent memory, which is characterized by the high speed writing, high speed operation and small energy consumption, created by specialists hitachi and Renesas technology. Companies represented the module with density 512 KB, that works with voltage 1,5 v, which demonstrated record and reading at a rate of 416 KB/s with the time of access 20 ns. In the development found a use the created previously technology weak element of memory, constructed on the change phase state. The current record of memory is 100 A. New memory will be used as built in energy-independent memory micro-controllers and to system-on- microcircuit. The idea of memory, built on the change phase state, or phase memory consists in the fact that the material, utilized for preparing the information layer, can assume two states, that are distinguished by the electrical properties, in particular, by resistance. The high resistance, characteristic of amorphous state, presents logical 1 - low, characteristic of crystalline state, designates logical 0. The short-term heating of the section layer is used for the passage of one state to another. Experimental 512- KB module was prepared with the aid of the modified by 130- nm CMOS- process. phase memory hitachi	Add Comment ( 0 ) PHASE MEMORY HITACHI

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