Than is good the lithograph with the use of ultrahard ultraviolet radiation, is more frequent that mentioned in the form of abbreviation EUV, we learned in 2005 because of company intel, which expects to inject this technology of within its 32 nm (0.032 m) technical process. If today's lithographic tools with the wavelength 193 nm make possible to create elements with the minimal sizes of 40-50 nm, then EUV- lithograph is capable of creating transistors with the aid of laser with wavelength 13,5 nm, i.e., using 14 times a thinner brush.
Some information about the plans IBM on the passage to EUV- lithograph last week published site EE times. In the opinion experts, scaling contemporary immersion lithograph with the use 193 nm of tools beyond the limits of 40 nm technical process is associated with the technical difficulties, and passage to the EUV- lithograph many seemed the solution of problem. It was planned, that the introduction of this technology of start in 2009, in the production program IBM coinciding with the moment of passing n 3. nm technical process.
However, the representatives OF IBM last week stated that the immersion lithograph with wavelength 193 nm will be used also for the production 22 nm (0.022 m) product, which puts aside the periods of introduction EUV- lithograph for later period. Problem in the fact that IBM will not have time to inject EUV- lithograph to 2009, although some developments in this sphere will be by this time actively conducted. Is possible, the active of EUV- technologies start only in the following decade, since even release 22 nm products IBM plans to achieve with the use of 193 nm of immersion lithograph.
Such delays will not show influence on the graph of the mastery of the nearest technological at the end 2007 IBM will start the mastery 45 nm technology, the company already reported about the successes in this sphere. Within the framework this technical process is planned to use 193 nm immersion lithograph. Accordingly, the same tools with the necessary modifications will be used, also, for the production 32 nm of products in 2009. It would be desirable to believe that adherence to the already known lithographic technologies to a certain extent IBM from the problems upon transfer to the sequential technological standards.
Many partners IBM will follow the analogous graph of modernization lithographic technology. In their number will be AMD Chartered semiconductor, and also Infineon and Micron. Companies TSMC and UMC will begin to use a immersion lithograph of the within the framework 45 nm technical process or even earlier.
The company intel intends to go by its : with the production of 45 nm processors it will forego the immersion lithograph with the application of special layer liquid between the projecting lens and the silicic plate of in favor traditional dry 193 nm of lithograph. The analogous dry version 193 nm lithograph now uses IBM for the production of its 65 nm of products. For the production 32 nm of processors intel it can as use EUV- lithograph, as already it promised, so also to inject immersion lithograph. According to the estimation of our associates from site EE times, the introduction of EUV- technology by the company intel is more probably already in the subsequent for 32 nm technical processes.