winbond 80nm memory

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POSTER: computer news   ||   WINBOND 80NM MEMORY	DATE:2007-02-06
The representatives of company winbond electronics reported that this producer is prepared to start in the second quarter of present year 80- nm technological process for DRAM chips . So uncommon selection of technology while the majority of producers report about the introduction of  70- nm standards, Winbond explains this by the fact that it will allow to continue production on the existing equipment, at the given moment which released the base layers on 90 nm technical process. Company expects that the expenditures for the modernization of factories will be insignificant, and the release of chips will increase by 10-20%. In passed January the producer released 25-26 thousand 300- mm base layers. At present Winbond completes the introduction 90 nm technical process, moreover even in the current block 110- nm chips DRAM will predominate in the structure of its production (39% against 35% 90 nm products). Thus, we see that the technological break between the producers of memory in the first and second echelons increases with each month. For comparison, Samsung in autumn released the first chip 50- nm DRAM. Under such conditions to compete Winbond with the leaders will be complicated.	WINBOND 80NM MEMORY

	uspct is your : Video card - cpu - memory - Hard drive - power supply unit source

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winbond 80nm memory (2007-02-06)

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