On strategy, which Intel calls Tick-Tock model, and which consists in the fact that the architecture checked is transferred into the new technical process, after which the processors of new architecture are released according to the already checked technological standards, we already said. The following technical process, 45 nm, will be mastered by company on the processors of generations penryn - Yorkfield and Wolfdate (Wolfdale), which too architecturally are not differed from present Core 2 Duo/extreme. change in architecture will occur in the generation processors nehalem.
However, about some technological update, which will be inculcated in Penryn, politely described the leaders Of intel, Mark Bohr Steve Smith.
Thus, dual core processors penryn (code name wolfdate) will consist on 410 mln. transistors, four core processor Wolfdate - 820 mln. for comparison - into Conroe (Core 2 Duo) - 298 mln. transistors.
The retention of processor socket 775 for such processors will not become the guarantee of compatability with present motherboard with them - there is probability of electrical incompatibility.
Representatives Intel confirmed that Penryn will differ from Conroe in terms of the new materials, utilized as the dielectric - will be produced failure from silicon dioxide, which is used Intel last of decade, in the benefit of dielectrics with the high dielectric constant (high- k). This will make possible to forego the locks from polycrystalline silicon and to use metallic. Only this one step is capable by 20% to increase the switching rate of transistors and to, as a result, increase processor speed .
Gordon Moore, the author of famous law, calls the introduction high- k dielectrics very significant change in the technology production transistors from the end 60- X years. Then were represented transistors with the ploly lock.
The material, utilized as high- k dielectric, contains hafnium, there is no other information about it.
The production of processors penryn starts in the second-half of the present year at the factories D 1d in Oregon, Fab 32 in Arizona and, only later, to Fab 28 in Israel.
Also something it was described by the officials intel, also, about the more distant plans of company. The production schedule in the improvement of lithographic processes intel does not from now on conclude with 32- nm by standards. The technical process, which has the code name p1270 will they will take root by company beginning from 2011 and will be indicate the beginning of introduction 22- nm n.
Completed their appearance representatives Intel by the following thesis: The architecture nehalem will appear in 2008.